Stress Analysis of Bonded Assemblies: Applications in Microelectronics

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Artikelnummer:
1052799
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    Stress Analysis of Bonded Assemblies: Applications in Microelectronics

    Four analytical models are developed for predictingthe maximum shearing displacement in a bondedassembly under global thermal mismatch loading.Analytical model includes: i) elastic analysis, ii)elasto-plastic analysis, iii) viscoelastic analysis,and iv) viscoelastic-plastic analysis.All results have been derived as closed-formcorrection factors to be applied to the easilycalculated unconstrained shear displacement to obtainthe maximum shear displacement. The motivation fordetermining the maximum shear displacement is tocompute the maximum shear strain, which is then usedto estimate the cycles-to-failure by means of afatigue law.The analytical relations derived are simple,easy-to-use, and helpful for studying the interactionamong the various design parameters. The analyticalrelations are in good agreement with existingexperimental and numerical results.
  • Zusatzinformation

    Autor
    Bindung
    Taschenbuch
    Verlag
    VDM Verlag Dr. Müller
    ISBN / EAN
    9783639060324
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